Process Description:
RFID reading and writing, wafer status visual inspection, FOSB Accessories removal, label printing and attaching, heat-sealing PE & Alu bags after vacuuming, visual inspection for the heat sealing effects.
Key parameters:
-- Clean standard: cleanroom class 10
-- Cleanroom robot: Kuka cleanroom robots x3sets
-- CCD inspection at FOSB incoming station and after the heat-sealing process completion.
-- UPH: 20 FOSB/hr
-- Machine dimension: 4500 (L)*5600(W) *2600(H)mm
Application:
Mainly applied for 300mm FOSB/FOUP automatic packaging, and also can be adjusted for wafer carrier packaging demand with other spec.
